Impossible know without the datasheet of that compound. Very few products are using this as far as I'm aware.What kind of temperature reduction would be expected if the cured thermal compound was still applied and not torn off? 10-15 degrees?
It should have a very nice viscosity when applied in liquid form going through microscopic cracks before curing in place. It seems to remove the need for loading pressure on pads. Even if they clean it up and replace this with a traditional silpad, they might not have the recommended compression applied to the pad as per manufacturers recommendation. It depends if the top aluminum EMI shield was designed to swap these with silpads.