Thanks to gofreak and anexanhume for the finding
It seems ASus will use to liquid metal for future laptop, thanks to androvsky
EDIT:
WIPO - Search International and National Patent Collections
patentscope.wipo.int
The present invention provides a structure in which a metal having fluidity is utilized as a heat conductive material. In this structure, a heat conductive material is prevented from invading an unintended region even when a positional change of a semiconductor device occurs or a vibration occurs. This electronic apparatus has a heat conductive material (31) formed between a heat radiator (50) and a semiconductor chip (11). The heat conductive material (31) has fluidity at least when the semiconductor chip (11) is in operation. The heat conductive material (31) has electroconductivity. The heat conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating section (15).
It seems ASus will use to liquid metal for future laptop, thanks to androvsky
EDIT:
Asus Will Use Liquid Metal Thermal Paste in Its Laptops - ExtremeTech
Asus will adopt liquid metal thermal paste on its Intel 10th Gen laptops, to improve cooling temperatures -- and help handle the heat.
www.extremetech.com
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