I don't delid and it's not that drastic compared to a good thermal paste. I oc to 5ghz and have used both with a small difference in performance.
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Sony patent for APU liquid metal cooling and Gamernexus saying this is a part of PS5 cooling system
- Thread starter chris 1515
- Start date
I hope it works.
Much more efficient transfer.
Can't read the patent but I'm going to go out on a limb and say it's not that kind of molten. It's just liquid metal. Mercury doesn't have to be hot to be a liquid.
No, it confirms it won't run hot because of the engineering in the cooling. Cerny himself said GPU clocks are power and timing limited, not thermally.
yall, this shit costs like $10
and that's for consumers. Companies would get it at much lower costs.
$10 for consumers + in a whole tube.
Sony's only applying how much is needed.
Yep. I get that many here don't really follow tech (especially PC tech) outside of consoles, but lol these posts sometimes... I swear.
Who the hell said groundbreaking new tech other than you right now? This is fucking fantastic for consoles and so much more efficient for heat transfer. It is very much special compared to regular thermal paste.
Depending on your CPU, you might need to delid in order to get the most out of liquid metal. A lot of Intel CPUs use cheap thermal paste between the die and IHS, and that's going to greatly limit the effectiveness of any TIM used between the IHS and heatsink, no matter how exotic.
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hopefully that ends up being the case
this is my understanding of the more general use-case of liquid metal, there's almost no difference unless it's applied to the die itself
That and some of them are in bad faith.
"Sony will use gold capacitors in US version of console instead of only Japanese version"
"OH SO I GUESS $700 PS5 THERE IT IS..."
The number is when comparing to stock cooler, which is well, shit.
So have I with but with a big difference in overall system temps, noise and stability. It is much better if applied correctly than regular paste or high performance thermal paste. To get the most out of it, you MUST delid.
Then what are you comparing it against, to say it's nothing special if not thermal paste?
Liquid metal is dope. I have it on both my PC and PS4 Pro and it works great. 6-7 degrees might not sound impressive but it's enough to make my PC run silent under load.
Yeah I know delidding can provide a performance boost it also scares the shit out of me. I only have the courage to Lapp my CPU and cooler... Lol
If they don't want a repeat of the PS4, the bigger issue is they have to use a higher quality thermal paste. IMO what's happening with most PS4/PS4 pro nowadays is the paste drying up and not effective in transfering heat from board to HS. I've fixed some PS4 heat issues and the paste is ALWAYS dried out.
It's actually the same symptoms of tower fans in PCs that are hitting over 80c when they shouldn't.
edit: This topic has me really curious at the Xbox X thermal paste solution, unfortunately I havn't seen any.
It's actually the same symptoms of tower fans in PCs that are hitting over 80c when they shouldn't.
edit: This topic has me really curious at the Xbox X thermal paste solution, unfortunately I havn't seen any.
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I'm talking about the idea of using liquid metal as a means of lowering temperature
are you intentionally misreading my posts or something?
I think it confirms the design philosophy of the PS5 APU. Lower core count at higher clocks and system designed around it. I imagine that it costs less than a larger APU.
PS5 GPU runs at 20+% faster than the series X. Maybe these few dollars gave them ~20% more performance.
I am however taking it as "effective but not actually that unusual to use." Kinda like how many computers have SSDs these days.
Without delidding you wont get the full benefits of it, you're still being limited by the thermal compound/solder between the ihs and die.
Makes sense given that Sony is highly automating the PS5 production.
Nah, we know you're putting horizontal to hide the disc drive bulge. /s
I'm doing that, anyway.
No, it confirms that the PS5's APU is running very hot, otherwise Sony wouldn't bother with liquid metal, and instead they would use cheaper and easier thermal paste.
I'm pretty sure in cases where the IHS is solderd to the die (like most AMD CPUs and i think the most recent gen of Intel CPUs) it'd be perfectly effective without a delid. It's just that Intel cheaping out and using paste for the IHS is why delidding and liquid metal became so popular in the enthusiast space.
It's not THAT absurd. I've seen more than a few people simply apply some nail polish on the PCB around the die to avoid any liquid metal potentially leaking out and frying something.
the 10-20c figure that people are throwing around is not what you'd get out of a properly TIM'd CPU with a regular cooler compared to thermal paste
those figures are most likely sourced from folks who delidded due to Intel's shitty TIM between the die and IHS, as you said.
God damn, so glad this is the first post. It's like you read my mind.
Let's not overexagerate. It's 2-3 degrees better than good quality thermal paste.
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Thermal paste is an often-overlooked part of most computer setups. You can simply use the pre-applied stuff, or the thermal paste that comes with your motherboard, and still get reasonable processor t... Air Cooling for i9 [email protected] GHz 1.35V
That must be some shitty thermal paste or someone who puts the entire tube of thermal paste between the CPU & cooler. I wouldn't say those cases are normal.
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Maybe? Sony (and a lot of PS4 customers) already weren't happy with the PS4's cooling solution, so even assuming the PS5 uses exactly the same amount of power as the PS4, Sony was going to change it up. That they've gone this far does suggest the PS5 woud've run hotter if Sony hadn't changed anything.
The patent isn't about using it, it's about how to contain it.
To be fair, it's not like Sony was using the best thermal paste before. :)Let's not overexagerate. It's 2-3 degrees better than good quality thermal paste.
Guru3D Thermal Paste Roundup 2019
Thermal paste is an often-overlooked part of most computer setups. You can simply use the pre-applied stuff, or the thermal paste that comes with your motherboard, and still get reasonable processor t... Air Cooling for i9 [email protected] GHz 1.35Vwww.guru3d.com
Well it won't be hotter than usual with liquid metal. It confirms the APU is indeed clocked very high, and that those clocks are meant to be sustained most of the time.
They're not literally patenting the use of liquid metal. Just their design for a structure for keeping it in place.
As someone already answered above, the patent isn't for liquid metal or for using the liquid metal, it's for a special cooling system designed to contain the liquid metal within it and keep it from leaking out.
Funnily when they showed the DE I thought that looked ok vertical. But then later I saw a shot of it horizontal and it looks a bit odd - regular seems ok with the drive giving it some 'base' almost.
yall, this shit costs like $10
and that's for consumers. Companies would get it at much lower costs.
Perfect reaction.
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I *think* it also means the liquid metal is going to be cooling more than just the APU chip itself, but I am VERY BAD at reading the jargon and language used in patents, so someone else might be able to answer that better. :(
At low thermal density it didn't seem to be worth it. I remember a tests many years ago (when it was a new thing, at $50 for the kit) with a <100W CPUs which barely have one degree difference. So on a large SoC and low clock like the launch PS4 you'd get almost no advantage. However the PS5 is an idea candidate, lots of watts on such a small die.