the die size alone doesnt give us the entire picture though. If Cerny is trying to hit the perfect sweet spot of performance and price like he did with the pro and ps4, we might see a 350mm2 chip clocked really really low. 350mm2 (base ps4 die size) can get you 50+ cus but if they have to be clocked so low a simple fan can cool it then we are looking at a 1.0 ghz clockspeed.Question: Do you think the PS5 SOC will be larger than any of the current gen consoles (largest being XB1 vanilla at 363mm^2)? If yes, do you think it will be larger than the XSX?
Personally I think it'll be between 315-350 mm^2 (pure speculation). I'm not sure if 36 CUs and/or ~2.0 GHZ are the right numbers, but I do think we'll see less CUs than the XSX, as well as likely higher clocks. I think there is credence with the various info on Ariel/Oberon, etc. I also think with Mark Cerny leading development again, he'll have similar goals as he did on the PS4 and Pro - hitting the perfect sweet spot of performance and price. Which is why I think we'll see a PS5 die size in the range of the current Playstation dies.
50-52 active is probably the most the can put in a 350mm2 chip. at around 1.0 ghz, you get 6.6 tflops. at 1.4 ghz which is already pushing the gpu over 100w you will be looking at a 9.3 tflops gpu which will require some additional investment in cooling which will mess with his price range. (if it is $399)
basically, if they go with 316 or 350mm2 they will have to invest in better cooling and that will mess with their BOM if they are aiming for the ps4 and pro price range. i think they know this and figured they will blow past the $399 price tag anyway and decided to compete with MS on the specs while going all out themselves on ssd, ram and other luxury tech like 3d audio.