We've had a few guesses, but not a lot of evidence one way or another. Cooling two separate arms of the V shape is probably part of the obsession with dual-GPU designs. What looks to be a tangential or cross-flow design is wildly unconventional for consumer electronics applications. I can't imagine why they'd do something so unusual in a dev kit if they weren't using it as a test-bed for the retail version. It's not like you can't aggressively cool power-hungry designs in a fairly conventional tower arrangement! Apple's Mac Pro has a 1.5kW power supply, for instance.
Perhaps someone with relevant mechanical engineering expertise can comment, but I was under the impression this kind of design was relatively inefficient and better for moving air across a large area rather than targeted cooling.
