Try flipping your PS4 upside down and tell us how that goes.
No.
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Next-gen PS5 and next Xbox speculation launch thread |OT6| - Mostly Fan Noise and Hot Air
- Thread starter Mecha Meister
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If you flip it, it will probably fill even faster with dust, since the ground is usually prime dust gathering point.
Did you watch the video? I was asking this because the one in the video who posted the photo shwoed the rubber parts on the top of the devkit which may work as a support to flip the console and support its weight and he even showed that in a 3D video.
Yeah this is what scares me even more. Then why those rubber parts exist for then?
They looked more like stands for another devkit to sit on top of it.
He says rubber, but I see no rubber there, just the concave indentation.
Now that you mentioend yet, those parts seem kinda hollow to me. Then again why would devs slot or encase multiple devkits on top of each others? To gain space? But this gonna make the whole cluster even hotter and the bottom console gonna suffer from overweight too. I can't find a logical explanation for any of those.
Yes, to save space... It's how other devkits work as well.
Yeah but this devkit seems to be in a drawer or shelf, so there is no space to gain. Also I don't imagine offices of gaming companies haveing enough space to build a tower of devkits to gain space. This would paradoxical .
Would be interesting if PS5 is anything like that dev kit .
Just having a black box so normal now lol.
Just having a black box so normal now lol.
The problem is not cats, the problem if someone is living Joe's apartment.
Someone in reddit PS4 posted a NSFW picture of the invaded entrails of his PS4. No need to look for it.
No need to even imagine the PS5 or this devkit after one day only.
As someone who worked in a video game office not so long ago, building towers out of consoles and dev kits is almost tradition. So much so that IT used to yell at people doing it because they'd cause some consoles to overheat and die (Xbox One's don't like having things stacked on top of them).
Edit: think the craziest tower I saw was 4 X1s all on-top of each other because someone was solo testing network latency things.
Yeah, this is what I was talking about. I don't think this is a good idea to start with. With the PS5 clock speeds, Sony seem to have opened the console from every inch with those air vents too cool things down. building a tower of those devkits will just cause a fire in the entire building, God forbids, not just ovearheating.
Can you pls embed the original video to it please? To clear things up. Thanks.
Sony's had hw acceleration for use cases like foveated rendering since 2016. While that approach could lead to a variant of VRS(a superset really) I wouldn't take it for granted on the idea of eye tracking alone.
I think after FFVII I'm just gonna stop buying games till next-gen.
I may get DS but won't touch it till it gets updated for PS5. I don't want to get spoiled before the real deal.
Then why get it at al... surely by the time the PS5 comes along it will be at least half the price... along with whatever extras that would have been released between now and then. At least that's what I am hoping. I've got this little fantasy where I get DS, TLOU2, FF7R, and Cyberpunk all on the PS5 for under $150.
It should be interesting being that I only buy digital.
I missed many Sony games in pre-order so I missed all the pre-order exclusive items and Sony never sells them after unlike S-E or Capcom. This time I won't miss any bonus.
Mitigated by chassis size, fan sizing and geometry of the air flow path..... so in the end it boils down to cost.
Maybe they'll have an Enhanced PS4 Games Sale on the day of the PS5 launch.
I wound't take any chances with TLOU2, DS and Cyberpunk. The spoilers will be out there, it will just ruin the experience
Hope they keep some variation of the dev-kit "V" for the final console.
It's only a matter of time before we get the leaks everyone is clamoring for, there's finally getting to be enough leaked information out there people in the know are getting comfortable leaking without it easily being traced back to one source.
It's only a matter of time before we get the leaks everyone is clamoring for, there's finally getting to be enough leaked information out there people in the know are getting comfortable leaking without it easily being traced back to one source.
Not really true.
The basic equation for heat transfer is:
Q = U A Delta T
Where,
Q = heat transferred in Watts
A = is the surface area for heat exchange
Delta T = is the corrected average temperature differential, which is rather a bit more complicated than just the difference between the metal surface temp or core temp and bulk air temperature
and U = the overall heat transfer coefficient which is a combination function of the reciprocal of the individual thermal resistances of the system.
What you have to consider are the various mechanisms for heat exchange at work. You have:
- Heat transfers between the processor and the PCB - via conduction
- Heat transferred between the processor and the metal block cover (connected to the phase-change device) - via conduction
- Heat transfer between the metal block cover and the phase change device, e.g. heat pipes or gap chamber - via conduction and convection, as well as phase change of water within the device.
- Heat transfer at the condensing end of the phase change device with the finned metal heat sink - via phase-change, convection and conduction
- Heat transfer between the finned metal and the film of air local to the metal surface and then between the film (the thickness and thermal properties of which are a function of the fluid flow characteristics) and bulk air fluid
In any instance in time where there is an imbalance in the above heat flows, there will be thermal accumulation, increasing temps until the driving force for heat exchange, i.e. temperature differential, is high enough to reach thermal equilibrium — thus the heat flows will eventually balance.
So there's no possible way any console or computing device cooler is designed such that you cannot remove heat fast enough to stop the IHS heating at steady operation of the device. You may see this during a transient, but eventually a thermal equilibrium will be reached.
Anyway, I think this is all getting a little OT now.
This confirms that PS4 BC will recurve Pro like patches to add functionality. I could see them labeling PS4 games in 2020 as PS5 and PS4 like Xbox one does with BC 360 games
It could just as well be the initial wave of dev kits actually sent out to devs. That's a kind of ambiguous name.
I thought about this and my guess is it's the first version with actual APU silicon from AMD buuut I do admit it is weird to list it that way.
An indie developer in the dev-kit thread already answered the prototype question:
my issue isnt the mention of prototype, it is the mention of prototype 1 . it is not the first dev kit.
Is this real? EDIT: (It definitely looks real to me)
looks okay to me..
Note that I have absolutely no idea if this is real or not, I know nothing about the PS5. I was answering a question when someone asked if it was common for hardware like this to say "prototype" on them.
That said, who knows what "prototype-1" refers to if this is real, it doesn't necessarily refer to the actual first prototype. This could be the first prototype of this revision. This could be a prototype of this case. This could be a prototype for trade shows labeled to keep track of things. Who knows?
It could easily be shorthand for Prototype Series 1, rather than literally Prototype number 1.
Great post, and thanks for that... I still have an issue though.
Ok, from what you are saying, eventually everything balances out. But that's not really indicative of how cooling solutions work in general. Being that there are restrictions.
Sure if we had a big enough IHS, a cold enough block cover, an efficient enough heat sink/radiator and big enough fans, we can dissipate a significantly larger watt of heat. But within the confines of these systems, something in that chan of components presents that imbalance. And processors have to work within a certain temp margin as you know; so once that imbalance hits, something has to give.
With PCs, they can just throttle te chips, reducing how much heat its putting out so that the system gets back within balance. With consoles, they don't have that luxury, so they try and build a system that can keep the chips at a fixed clock for a very very very long time barring any external factors or component failures.
I tend to look at cooling in a much simpler way. From bottom to top,going from hottest to coldest. So say Step 1 is the chip, 2 the IHS, 3 the block, and 4 the heat sink...etc. Everything after one is basically playing catch up. say for instance a chip generates 300W of heat if the IHS/block connection is somehow able to dissipate all of that 300W instantly, that chip technically would never get hot, the heat energy would just be transferred. Because its heat is being removed as fast as it can make it. Unfortunately, we don't have a system that can do that.
This is why I say that the cooling solution cannot remove the heat as fast as its being made, because it's not preventing the temps within the chip from climbing. Maybe how I understand all this is very wrong, in which case I would just say I appreciate the time and detail you put into your response and if I am totally wrong just point say so and I'll take correction :)
No worries, you mentioning the prototype terminology being mentioned with legit dev kits in the past felt worthy of bringing up in here. Didn't intend it to sound like it was defacto proof the pic is real.
With Photoshop and 3D printing, most anything can be faked at this point.
It's improved since then, but it's hardly a differentiator, as nothing's stopping both platforms from using it, and it obviously won't be used for offline games.
I... Well, I might regret this. I'm not trying to be a dick, but has Richard ever give out actual new info on next-gen and not just refer to another rumor we've talked about to death?
As far as I remember, the spec-speculation that DF did pre-RDNA announcement wasn't particularly different than the more technical posts in the previous OTs. And just like us, they were dismissive of fast SSDs and RT support (which they arguably still are for that last one). They were just as behind as the rest of us on Lockhart. And as reliant on Komachi's tweets.
I don't doubt Richard's industry connections, probably knows more than he's shared, but I'm unsure that he has provided much in terms of accurate insider info so far. And to be fair, I don't think he ever made it seem that he was going to, so...
I don't recall. The latest wired article does mention the CPU and GPU separately. (Like, they don't say there is a separate CPU and GPU, but they write it like that.)
Either way, I think the V shape's gonna stay with us and it implies Sony put serious thought into cooling.
Why would they do that ? There's litterally no benefit since it's the same vendor for both the cpu and gpu.
That'd only raise the price and the complexity.
And dev kits aren't an indicator of a cooling solution. Look at the PS4 dev kit.
Yes, sort of. They've talked about it on stage, they keep refering to it by "a custom chip".
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