Thanks! My thought was that if conceptualized from the beginning, you could downgrade higher SKU CPUs to lower tier SKU CPUs. The cost equation would be whether it was worth it to make the lower tier SKU package accept a higher tier "reject" die and its own customized die, but it doesn't surprise me the economics don't work on that.
There are a lot of reasons why this doesn't work but I'll give a simple example.
For binning to make sense, first the performance increase has to be enough more for people to care. So debate #1 (using Scorpio) is 6.6tflops enough more power to charge more money than 6? Your mileage may vary on this answer.
Second, you now have to build a case that can reliably handle 6.6tflops. This will not be the same case that can handle 6. So question #2 is - do you build a different case, power supply, etc. for this version, or do you make every version of the console capable of handling the higher-performing chips?
Both solutions are expensive - you either pay for an entirely new design, or you over-pay on every single one.
So right there the concept sort of fails. In the case of the Scorpio dev-kit, that was already going to be a much different design, it's a small-run product with a lot of changes and is very, very expensive to build which is typical for bespoke development kits. So it was a no-brainer for those consoles but would make for bad economics at mass scale.